- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
Patent holdings for IPC class H01L 21/48
Total number of patents in this class: 11754
10-year publication summary
705
|
1048
|
1299
|
1323
|
1280
|
1396
|
1234
|
1281
|
1212
|
525
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
1764 |
Intel Corporation | 45621 |
818 |
Samsung Electronics Co., Ltd. | 131630 |
445 |
Texas Instruments Incorporated | 19376 |
389 |
Advanced Semiconductor Engineering, Inc. | 1546 |
364 |
Infineon Technologies AG | 8189 |
274 |
International Business Machines Corporation | 60644 |
247 |
STATS ChipPAC Pte. Lte. | 1516 |
234 |
Micron Technology, Inc. | 24960 |
195 |
Qualcomm Incorporated | 76576 |
176 |
Shinko Electric Industries Co., Ltd. | 1186 |
173 |
Semiconductor Components Industries, L.L.C. | 5345 |
161 |
Invensas Corporation | 645 |
149 |
Mitsubishi Electric Corporation | 43934 |
140 |
Siliconware Precision Industries Co., Ltd. | 489 |
140 |
Amkor Technology Singapore Holding Pte. Ltd | 314 |
136 |
NXP USA, Inc. | 4155 |
134 |
Fuji Electric Co., Ltd. | 4750 |
112 |
Renesas Electronics Corporation | 6305 |
108 |
Rohm Co., Ltd. | 5843 |
101 |
Other owners | 5494 |